| K | Memory | |
| F | OneNAND Flash | |
| X | Small Classification | D = De-Muxed w/o RDY
E = De-Muxed 2 die stack w/o RDY
G = De-Muxed
H = De-Muxed 2 die stack
K = Muxed 4 die stack w/dual nCE
M = Muxed
N = Muxed 2 die stack
W = De-Muxed 4 die stack w/dual nCE
|
| XX | Density | 12 = 512M
28 = 128M
56 = 256M
1G = 1G
2G = 2G
4G = 4G
8G = 8G |
| X | Technology | 1 = SLC
M = MLC
H = Hybrid |
| X | Organization | 6 = x16 |
| X | Vcc | D = 2.5V/2.7V (2.4V to 3.0V)
Q = 1.8V (1.7V to 1.95V)
U = 3.0V/3.3V (2.7V to 3.6V) |
| X | Mode | 0 = 512 byte page
1 = 1K byte page
2 = 2K byte page
4 = 4K byte page
|
| X | Generation | M = 1st generation
A = 2nd generation
B = 3rd generation
C = 4th generatio
D = 5th generatio
|
| X | Package Type | F = FBGA
D = FBGA (Lead-free)
L = ULGA (Lead-free)
M = FBGA (Lead-free, SAC105)
N = FBGA (Lead-free 35)
Y = TSOP1
P = TSOP1 (Lead-free)
S = FBGA (Lead-free, special)
C = Chip BIZ
W = Wafer
|
| X | Temperature Range | C = Commercial
E = Extend
I = Industrial
0 = None |
| X | Bad Block | 0 = None
B = Include bad block
D = Daisychain sample |
| X | Speed | 0 = Reserved
5 = 54 MHz
6 = 66 MHz
8 = 83 MHz |
| X | Packing Type | T = Tape&Reel
0 = Other (Tray, Tube, Jar)
S = Stack
P = Module Tape&Reel
M = Module other packing |
| XX | Customer | |
